These are the sources and citations used to research Table A-3 Properties of Solid Metals: Thermal Conductivity. This bibliography was generated on Cite This For Me on

  • Book

    Çengel, Y. A. and Ghajar, A. J.

    Heat and mass transfer

    2015 - McGraw-Hill - New York, N.Y.

    In-text: (Çengel and Ghajar, 2015)

    Your Bibliography: Çengel, Y. and Ghajar, A., 2015. Heat and mass transfer. New York, N.Y.: McGraw-Hill.

  • Website

    The Heatsink Guide - Case Cooling

    2010

    In-text: (The Heatsink Guide - Case Cooling, 2010)

    Your Bibliography: Heatsink-guide.com. 2010. The Heatsink Guide - Case Cooling. [online] Available at: <http://www.heatsink-guide.com/compound.htm> [Accessed 3 February 2015].

  • E-book or PDF

    Lassaline, J. V.

    AER 423: Applied Thermodynamics and Heat Transfer Laboratory Manual

    2008 - Ryerson University Department of Aerospace Engineering - Toronto

    In-text: (Lassaline, 2008)

    Your Bibliography: Lassaline, J., 2008. AER 423: Applied Thermodynamics and Heat Transfer Laboratory Manual. 1st ed. [ebook] Toronto: Ryerson University Department of Aerospace Engineering. Available at: <https://courses.ryerson.ca/@@/A08F8E1990DF0E36E7AC49BDCC50115E/courses/1/aer423_w15_01/content/_2864318_1/simplex.pdf> [Accessed 3 February 2015].

  • Website

    Reducing Contact Thermal Resistance - Application Note - Lytron Inc

    2012

    In-text: (Reducing Contact Thermal Resistance - Application Note - Lytron Inc, 2012)

    Your Bibliography: Lytron.com. 2012. Reducing Contact Thermal Resistance - Application Note - Lytron Inc. [online] Available at: <http://www.lytron.com/Tools-and-Technical-Reference/Application-Notes/Reducing-Contact-Thermal-Resistance> [Accessed 3 February 2015].

  • E-book or PDF

    Shatil, A.

    Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules

    1999 - Virginia Tech - Virginia

    In-text: (Shatil, 1999)

    Your Bibliography: Shatil, A., 1999. Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules. 1st ed. [ebook] Virginia: Virginia Tech. Available at: <http://scholar.lib.vt.edu/theses/available/etd-0107100-102125/unrestricted/ch4.pdf> [Accessed 3 February 2015].

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